Metal-Dielectric Interfaces in Gigascale Electronics

Metal-Dielectric Interfaces in Gigascale Electronics

EnglishPaperback / softbackPrint on demand
He, Ming
Springer-Verlag New York Inc.
EAN: 9781493943081
Print on demand
Delivery on Tuesday, 11. of February 2025
€96.80
Common price €107.56
Discount 10%
pc
Do you want this product today?
Oxford Bookshop Banská Bystrica
not available
Oxford Bookshop Bratislava
not available
Oxford Bookshop Košice
not available

Detailed information

Metal-dielectric interfaces are ubiquitous in modern electronics. As advanced gigascale electronic devices continue to shrink, the stability of these interfaces is becoming an increasingly important issue that has a profound impact on the operational reliability of these devices. In this book, the authors present the basic science underlying  the thermal and electrical stability of metal-dielectric interfaces and its relationship to the operation of advanced interconnect systems in gigascale electronics. Interface phenomena, including chemical reactions between metals and dielectrics, metallic-atom diffusion, and ion drift, are discussed based on fundamental physical and chemical principles. Schematic diagrams are provided throughout the book to illustrate  interface phenomena and the principles that govern them.

Metal-Dielectric Interfaces in Gigascale Electronics  provides a unifying approach to the diverse and sometimes contradictory test results that are reported in the literature on metal-dielectric interfaces. The goal is to provide readers with a clear account of the relationship between interface science and its applications in interconnect structures. The material presented here will also be of interest to those engaged in field-effect transistor and memristor device research, as well as university researchers and industrial scientists working in the areas of electronic materials processing, semiconductor manufacturing, memory chips, and IC design.
EAN 9781493943081
ISBN 1493943081
Binding Paperback / softback
Publisher Springer-Verlag New York Inc.
Publication date August 23, 2016
Pages 149
Language English
Dimensions 235 x 155
Country United States
Readership General
Authors He, Ming; Lu, Toh-Ming
Illustrations XI, 149 p.
Edition Softcover reprint of the original 1st ed. 2012
Series Springer Series in Materials Science