Electrothermal Analysis of VLSI Systems

Electrothermal Analysis of VLSI Systems

AngličtinaMäkká väzbaTlač na objednávku
Yi-Kan Cheng
Springer-Verlag New York Inc.
EAN: 9781475773736
Tlač na objednávku
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Podrobné informácie

Electrothermal Analysis of VLSI Systems addresses electrothermal problems in modern VLSI systems.
Part I, The Building Blocks, discusses electrothermal phenomena and the fundamental building blocks that electrothermal simulation requires (including power analysis, temperature-dependent device modeling, thermal/electrothermal simulation, and experimental setup-calibration).
Part II, The Applications, discusses three important applications of VLSI electrothermal analysis including temperature-dependent electromigration diagnosis, cell-level thermal placement and temperature-driven power and timing analysis.
Electrothermal Analysis of VLSI Systems will be useful for researchers in the fields of IC reliability analysis and physical design, as well as VLSI designers and graduate students.
EAN 9781475773736
ISBN 1475773730
Typ produktu Mäkká väzba
Vydavateľ Springer-Verlag New York Inc.
Dátum vydania 20. apríla 2013
Stránky 210
Jazyk English
Rozmery 235 x 155
Krajina United States
Čitatelia Professional & Scholarly
Autori Chin-Chi Teng; Ching-Han Tsai; Sung-Mo (Steve) Kang; Yi-Kan Cheng
Ilustrácie XXIII, 210 p. 36 illus.