Wafer-Level Chip-Scale Packaging

Wafer-Level Chip-Scale Packaging

AngličtinaMäkká väzbaTlač na objednávku
Qu, Shichun
Springer-Verlag New York Inc.
EAN: 9781493954384
Tlač na objednávku
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Podrobné informácie

Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on the development of analog technology and power device integration. The book covers in detail how advances in semiconductor content, analog and power advanced WLCSP design, assembly, materials and reliability have co-enabled significant advances in fan-in and fan-out with redistributed layer (RDL) of analog and power device capability during recent years. Since the analog and power electronic wafer level packaging is different from regular digital and memory IC package, this book will systematically introduce the typical analog and power electronic wafer level packaging design, assembly process, materials, reliability and failure analysis, and material selection. Along with new analog and power WLCSP development, the roleof modeling is a key to assure successful package design. An overview of the analog and power WLCSP modeling and typical thermal, electrical and stress modeling methodologies is also presented in the book.
EAN 9781493954384
ISBN 1493954385
Typ produktu Mäkká väzba
Vydavateľ Springer-Verlag New York Inc.
Dátum vydania 23. augusta 2016
Stránky 322
Jazyk English
Rozmery 235 x 155
Krajina United States
Čitatelia Professional & Scholarly
Autori Liu, Yong; Qu, Shichun
Ilustrácie XVII, 322 p. 314 illus., 256 illus. in color.
Edícia Softcover reprint of the original 1st ed. 2015